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Characterization in silicon processing (Materials characterization series)


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CODE: MP-B0000020

Price: US$ 72.95
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Yale E. Strausser
Momentum Press, 2010
Total Pages: 258

Table of Content

Preface to the reissue of the materials characterization series
Preface to series
Preface to the reissue of characterization in silicon processing
1. Application of materials characterization techniques to silicon epitaxial growth
C. I. Drowley
2. Polysilicon conductors
Yale Strausser
3. Silicides
S. P. Murarka
4. Aluminum- and copper-based conductors
David Fanger and Roger Tonneman
5. Tungsten-based conductors
Roc Blumenthal and Gregory C. Smith
6. Barrier films
M. Lawrence A. Dass
Appendix: technique summaries
1. Auger electron spectroscopy (AES)*
2. Ballistic electron emission microscopy (BEEM)
Phillip Niedermann
3. Capacitance–voltage (C–V) measurements
George N. Maracas
4. Deep level transient spectroscopy (DLTS)
N. M. Johnson
5. Dynamic secondary ion mass spectrometry (D-SIMS)*
6. Electron beam induced current (EBIC) microscopy
David C. Joy
7. Energy-dispersive x-ray spectroscopy (EDS)*
8. Focused ion beams (FIBs)
Jon Orloff
9. Fourier transform infrared spectroscopy (FTIR)*
10. Hall effect resistivity measurements
George N. Maracas
11. Inductively coupled plasma mass spectrometry (ICPMS)*
12. Light microscopy*
13. Low-energy electron diffraction (LEED)*
14. Neutron activation analysis (NAA)*
15. Optical scatterometry*
16. Photoluminescence (PL)*
17. Raman spectroscopy*
18. Reflection high-energy electron diffraction (RHEED)*
19. Rutherford backscattering spectrometry (RBS)*
20. Scanning electron microscopy (SEM)*
21. Scanning transmission electron microscopy (STEM)*
22. Scanning tunneling microscopy and scanning force microscopy (STM and SFM)*
23. Sheet resistance and the four point probe
Walter Johnson and Chuck Yarling
24. Spreading resistance analysis (SRA)
Roger Brennan and David Dickey
25. Static secondary ion mass spectrometry (Static SIMS)*
26. Surface roughness: Measurement, formation by sputtering, impact on depth profiling*
27. Total reflection x-ray fluorescence analysis (TXRF)*
28. Transmission electron microscopy (TEM)*
29. Variable-angle spectroscopic ellipsometry (VASE)*
30. X-ray diffraction (XRD)*
31. X-ray fluorescence (XRF)*
32. X-ray photoelectron spectroscopy (XPS)*