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Characterization of integrated circuit packaging materials (Materials characterization series)


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CODE: MP-B0000012

Price: US$ 72.95
1 (this product is electronically distributed)

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Thomas M. Moore,Robert G. McKenna
Momentum Press, 1993
Total Pages: 296

Table of Content

Preface to the reissue of the materials characterization series
Preface to series
Preface to the reissue of characterization of integrated circuit packaging materials
1. IC package reliability testing
Lawrence C. Wagner
2. Mold compound adhesion and strength
Samuel S. Kim
3. Mechanical stress in IC packages
Darvin R. Edwards and Steven K. Groothuis
4. Moisture sensitivity and delamination
Thomas M. Moore, Robert G. McKenna and Shawn J. Kelsall
5. Thermal management
Mostafa Aghazedeh
6. Electrical performance of IC packages
Eric Bogatin
7. Solderability of integrated circuits
James A. Kargol, Anthony M. Petrucci and Timothy M. McGuiggan
8. Hermeticity and joining in ceramic IC packages
Stephen R. Martin
9. Advanced interconnect technologies
Robert G. McKenna and Thomas M. Moore
Appendix: technique summaries
1. Acoustic microscopy (C-AM)
Thomas M. Moore
2. Atomic absorption spectrometry (AAS)
Thomas M. Moore
3. Auger electron spectroscopy (AES)*
4. Ceramic plate test (CPT) for evaluating the solderability of IC devices
Timothy McGuiggan
5. Coulometric method for solderability evaluation
Kuan-Shaur Lei
6. Decapsulation techniques
Lawrence C. Wagner
7. Differential scanning calorimetry (DSC)
Samuel S. Kim
8. Dynamic mechanical analysis
Herbert J. Moltzan
9. Dynamic secondary ion mass spectrometry (D-SIMS)*
10. Electron microprobe x-ray microanalysis (EPMA)*
11. Energy-dispersive x-ray spectroscopy (EDS)*
12. Finite element analysis (FEA)
Darvin R. Edwards and Steve Groothuis
13. Fourier transform infrared spectroscopy (FTIR)*
14. Inductively coupled plasma mass spectrometry (ICPMS)*
15. Inductively coupled plasma-optical emission spectroscopy (ICP-OES)*
16. In situ strain gauges
Darvin Edwards and Steve Groothuis
17. Ion chromatography
T. Talasek
18. Mechanical testing in IC packaging
Lawrence C. Wagner
19. Scanning electron microscopy (SEM)*
20. Scanning tunneling microscopy and scanning force microscopy (STM and SFM)*
21. Static secondary ion mass spectrometry (Static SIMS)*
22. Thermogravimetric analysis (TGA)
Herbert J. Moltzan
23. Thermomechanical analysis (TMA)
Herbert J. Moltzan
24. Torsional braid analysis (TBA)
Samuel S. Kim
25. Wetting balance method to evaluate the solderability of IC devices
Timothy McGuiggan
26. X-ray laminography
John Adams
27. X-ray photoelectron spectroscopy (XPS)*
28. X-ray radiographic inspection
Joseph Colangelo