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Characterization in compound semiconductor processing (Materials charactization series)


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CODE: MP-B0000009

Price: US$ 72.95
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Yale Strausser,Gary E. McGuire
Momentum Press, 1995
Total Pages: 217

Table of Content

Preface to the reissue of the materials characterization series
Preface to series
Preface to the reissue of characterization of compound semiconductor processing
1. Characterization of III–V thin films for electronic devices
J. N. Miller and T. S. Low
2. III–V compound semiconductor films for optical applications
Thomas F. Kuech
3. Contacts
T. Sands and S. A. Schwarz
4. Dielectric insulating layers
H. H. Wieder
5. Other compound semiconductor films
Owen K. Wu and David R. Rhiger
6. Deep level transient spectroscopy: A case study on GaAs
Werner K. Gotz and Noble M. Johnson
Appendix: technique summaries
1. Auger electron spectroscopy (AES)*
2. Ballistic electron emission microscopy (BEEM)
Phillip Niedermann
3. Capacitance–voltage (C–V) measurements
George N. Maracas
4. Deep level transient spectroscopy (DLTS)
N. M. Johnson
5. Dynamic secondary ion mass spectrometry (D-SIMS)*
6. Electron beam induced current (EBIC) microscopy
David C. Joy
7. Energy-dispersive x-ray spectroscopy (EDS)*
8. Focused ion beams (FIBs)
Jon Orloff
9. Fourier transform infrared spectroscopy (FTIR)*
10. Hall effect resistivity measurements
George N. Maracas
11. Inductively coupled plasma mass spectrometry (ICPMS)*
12. Light microscopy*
13. Low-energy electron diffraction (LEED)*
14. Neutron activation analysis (NAA)*
15. Optical scatterometry*
16. Photoluminescence (PL)*
17. Raman spectroscopy*
18. Reflection high-energy electron diffraction (RHEED)*
19. Rutherford backscattering spectrometry (RBS)*
20. Scanning electron microscopy (SEM)*
21. Scanning transmission electron microscopy (STEM)*
22. Scanning tunneling microscopy and scanning force microscopy (STM and SFM)*
23. Sheet resistance and the four point probe
Walter Johnson and Chuck Yarling
24. Spreading resistance analysis (SRA)
Roger Brennan and David Dickey
25. Static secondary ion mass spectrometry (Static SIMS)*
26. Surface roughness: measurement, formation by sputtering, impact on depth profiling*
27. Total reflection x-ray fluorescence analysis (TXRF)*
28. Transmission electron microscopy (TEM)*
29. Variable-angle spectroscopic ellipsometry (VASE)*
30. X-ray diffraction (XRD)*
31. X-ray fluorescence (XRF)*
32. X-ray photoelectron spectroscopy (XPS)*