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Characterization of metals and alloys (Materials characterization series)


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CODE: MP-B0000006

Price: US$ 72.95
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Paul H. Holloway,P. N. Vaidyanathan
Momentum Press, 1993
Total Pages: 330

Table of Content

Preface to the reissue of the materials characterization series
Preface to series
Preface to the reissue of characterization of metals and alloys
Acronyms glossary
1. Introduction
Paul H. Holloway and P. N Vaidyanathan
2. Mechanical properties and interfacial analysis
Clyde L. Briant
3. Chemical properties
Donald R. Baer
4. Surface and thin film analysis of diffusion in metals
Paul H. Holloway
5. Mineral processing and metal reclamation
Guy Remond and Jean-Luc Cecile
6. Melting and casting
Brian R. Strohmeier
7. Machining and working of metals
David A. Stout
8. Characterization of the cleaning of surfaces of metals and metal alloys
Paul A. Lindfors
9. Coatings and thin films
Ronald F. Roberts and Paul H. Holloway
10. Failure analysis
Charles R. Anderson
Appendix: technique summaries
1. Auger electron spectroscopy (AES)*
2. Cathodoluminescence (CL)*
3. Dynamic secondary ion mass spectrometry (D-SIMS)*
4. Elastic recoil spectrometry (ERS)*
5. Electron energy-loss spectroscopy in the transmission electron microscope (EELS)*
6. Electron microprobe x-ray microanalysis (EPMA)*
7. Energy-dispersive x-ray spectroscopy (EDS)*
8. Extended x-ray absorption fine structure (EXAFS)*
9. Field ion microscopy (FIM)
10. Fourier transform infrared spectroscopy (FTIR)*
11. Glow discharge mass spectrometry (GDMS)*
12. High resolution electron energy loss spectroscopy (HREELS)*
13. Inductively coupled plasma mass spectrometry (ICPMS)*
14. Inductively Coupled plasma-optical emission spectroscopy (ICP-OES)*
15. Ion scattering spectroscopy (ISS)*
16. Laser induced mass spectrometry (LIMS)*
17. Low-energy electron diffraction (LEED)*
18. Low-energy electron microscopy (LEEM)
19. Magneto-optic kerr effect (MOKE)*
20. Medium energy ion scattering (MEIS)*
21. Neutron activation analysis (NAA)*
22. Nuclear reaction analysis (NRA)*
23. Optical micro-reflectometry (OMR) and differential reflectometry (DR)
24. Optical second harmonic generation (SHG)
25. Particle induced x-ray emission (PIXE)*
26. Photoacoustic spectroscopy (PAS)
27. Photoelectron emission microscopy (PEEM)
28. Photoluminescence (PL)*
29. Reflected electron energy loss spectroscopy (REELS)*
30. Reflection high-energy electron diffraction (RHEED)*
31. Rutherford backscattering spectrometry (RBS)*
32. Scanning electron microscopy (SEM)*
33. Scanning transmission electron microscopy (STEM)*
34. Scanning tunneling microscopy and scanning force microscopy (STM and SFM)*
35. Solid state nuclear magnetic resonance (NMR)*
36. Spark source mass spectrometry (SSMS)*
37. Sputtered neutral mass spectrometry (SNMS)*
38. Static secondary ion mass spectrometry (Static SIMS)*
39. Surface analysis by laser ionization (SALI)*
40. Surface extended x-ray absorption fine structure and near edge x-ray absorption fine structure (SEXAFS/NEXAFS)*
41. Temperature programmed desorption (TPD)
42. Total refl ection x-ray fluorescence analysis (TXRF)*
43. Transmission electron microscopy (TEM)*
44. Ultraviolet photoelectron spectroscopy (UPS)*
45. Variable-angle spectroscopic ellipsometry (VASE)*
46. X-ray diffraction (XRD)*
47. X-ray fluorescence (XRF)*
48. X-ray photoelectron and auger electron diffraction (XPD and AED)*
49. X-ray photoelectron spectroscopy (XPS)*